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About GOULD Electronics

Electrodeposited copper foil has been used for half a century as raw material in microelectronics. GOULD was quick to recognize the opportunities and prospects that would present themselves in the PCB industry and to strategically invest in the technology of electroplating. As a result GOULD is one of the world’s leading supplier of high quality copper foil products. A large number of top-notch copper clad and PCB manufacturers are customers of GOULD. Thanks to our technological competence, quality, a high degree of customer orientation and our international orientation we have achieved a place among the top ED copper foil suppliers in the world.

1961
Foundation of Electrometall GmbH
1963
First production of ED copper foil in Eichstetten, Germany
1981
Nippon Mining becomes a JV-Partner
1993
Launch of CAC® business
2004
Transfer of assets from Gould US to NMM Tokyo
2006
Gould establishes HPCF to support US market
2008
Gould restructures its business
2011
50 years celebration
2012
DIN EN ISO 50001 certifcation