About GOULD Electronics
Electrodeposited copper foil has been used for half a century as raw material in microelectronics. GOULD was quick to recognize the opportunities and prospects that would present themselves in the PCB industry and to strategically invest in the technology of electroplating. As a result GOULD is one of the world’s leading supplier of high quality copper foil products. A large number of top-notch copper clad and PCB manufacturers are customers of GOULD. Thanks to our technological competence, quality, a high degree of customer orientation and our international orientation we have achieved a place among the top ED copper foil suppliers in the world.
- 1908
- First patent for electroplating copper foil issued to Edison
- 1963
- First production of ED copper foil in Eichstetten, Germany
- 1988
- GOULD acquired by Japan Energy (now Nippon Mining)
- 2000
- GOULD Germany opens new CAC®/CSC production facility
- 2003
- GOULD consolidates US operations in Chandler plant
- 2004
- Transfer of Eichstetten assets to Nikko Materials Tokyo
- 2006
- GOULD Germany starts support of North American market; foundation of HPCF Inc.