Advanced Interconnect Foils
Advanced interconnect foils from Gould are intended for leading edge technology applications such as high-end servers and medical instruments. They include:
Foil type |
IPC-4562 Grade |
Typical thickness µm |
Application |
|
|---|---|---|---|---|
3 |
12/18/35/70 |
multifunctional/high Tg Epoxy, green, filled/unfilled high frequency |
|
|
3 |
12/18/35/70 |
non-MDA PI |
|
|
3 |
12/18/35/70 |
multifunctional/high Tg Epoxy, green, filled/unfilled high frequency |
|
|
3 |
12/18/35/70 |
non-MDA PI |
|
