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Advanced Interconnect Foils

Advanced interconnect foils from Gould are intended for leading edge technology applications such as high-end servers and medical instruments. They include:

Foil Type

IPC-4562
Grade

Typical thickness
µm

Application

JTCHTEHP

3

9/12/18/35

multifunctional/high Tg Epoxy, green, filled/unfilled high frequency

JTCHTEAB

3

9/12/18/35

non-MDA PI

JD1HTEVLP

3

12/18/35

PTFE

RTCHTEHP

3

12/35

multifunctional/high Tg Epoxy, green, filled/unfilled high frequency

RD1HTEVLP

3

12/18/35

PTFE

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