RD1
Zinc-free Copper Foil Treatment- Compatible to acidic chemistry in electroless NiAu process
- Reverse treatment with very low profile high frequency applications
RD1HTE, Grade 3
is designed for special applications that require lowest treatment roughness (very low profile) on smart cards, high layer count multilayers, or PTFE laminates. Available also as RD1HTEVLP with very low profile on both sides.
Zinc-free Treatment
is Nickel Gold compatible. Acidic chemistry in electroless NiAu processes can undercut the zinc layer underneath fine lines, hence reduce contact area (acid undercut) and peel strength.
Thin Laminate and High Frequency Application
High layer count PCBs in mobile phones or applications in smart cards/labels require thin foils with low treatment roughness. RD1HTE is drum side treated with a fine nodularized zinc-free copper treatment which benefits fine line etching and impedance control.
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RD1HTE-35 μm
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RD1HTE-35 μm
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RD1HTEVLP-35 μm
| 1) Without plating up | ||||
| Property | Unit | RD1HTE (RD1S) - Grade 3 | ||
|---|---|---|---|---|
| 12 μm | 18 μm | 35 μm | ||
| Area weight | g/m2 | 105 | 155 | 285 |
| Tensile strength | N/mm2 | > 320 | > 320 | > 300 |
| Elongation | % | > 3 | > 4 | > 10 |
| Elongation 180°C | % | > 2 | > 3 | > 4 |
| Peel strength FR4-TG 140 | N/mm | > 1.051) | > 1.101) | > 1.42 |
| Treated shiny side, Rz | μm | < 5.1 | < 5.1 | < 5.1 |
| Untreated matte side, Rz | μm | 2.5...4 | 3.3...5 | 4...6 |
RD1HTE foils are routinely available in continuous rolls and sheeted formats. Roll products can be supplied in a variety of widths and thicknesses from 12 μm (0.375 oz/ft2) to 35 μm (1 oz/ft2). Other thicknesses on repuest. Products are supplied on cardboard cores with an ID of ~ 79 mm (3 1/8”) or 152 mm (6”).