is a multipurpose foil commonly used for a broad range of rigid laminates, glass epoxy composites and multilayer outside layer applications. The unique GOULD treatment process is designed to provide a consistent and accurately controlled high nodular treatment build-up to satisfy user's requirements of conductor line adhesion, fine-line etching, and dielectric spacing for controlled impedance circuit boards.
Thick JTC foils (>105 µm) enables the realization of circuitries for high power applications with large cross-sections on a small area. New applications that require higher performance in severe environments are now possible. Today's products that must withstand temperatures of up to +150° C and temperature cycles of - 40 to 150° C require printed circuits on suitable substrates such as modified FR-4 epoxy systems, high Tg resins or polyimides.
The risk of track cracking or delamination due to extreme temperatures can effectively be eliminated.
This water based adhesive system is compatible with paperphenolic laminate grades like XPC, XXXPC, FR1, FR2, FR3 and composites (CEM). Coatings are applied to 35 and 70 μm thick copper foils with a uniform adhesive thickness of 25…35 μm ensuring good wetting and consistent high laminate bond strength.
Copper nodules are plated on the pyramidal matte side surface in order to increase surface area and maximize laminate bond by interlocking with a variety of different resin systems. When tested on typical epoxy and multifunctional prepregs, in accordance with IPC testing requirements, JTC foils pass all tests, including high temperature peel, solder shock and accelerating aging.
JTC's thermal brass barrier layer retards the thermally and chemically induced degradation of foil adhesion often associated with alternative treatments.
is formulated to resist grain growth after thermal processing which could degrade laminate dimensional stability, warp & twist and drilling characteristics (nail heading).
The stabilizer (anti-tarnish passivation) avoids discoloration or oxidation during storage and lamination, and minimizes laminate staining reaction with curing agents. Additionally it facilitates chemical (and mechanical) cleaning.
The fine and uniform grain structure guarantees excellent etching characteristics such as etchability with reduced acid undercut.
The combination of all GOULD proprietary processes provides the industry with a foil that meets and exceeds the requirements of IPC 4562, Grade 1.
|1) Without plating up 2) After plating up|
|5 µm||9 μm||12 μm||18 μm||35 μm||50 µm||70 μm||105 μm||140 µm||175 µm||210 µm||375 µm||400 µm|
|Peel strength FR4-TG 140||N/mm||>0.602)||>1.001)||>1.051)||>1.181)||>1.69||>1.96||>2.28||>2.75||-/-||-/-||-/-||-/-||-/-|
|Shiny side, Ra||μm||<0.43||<0.43||<0.43||<0.43||<0.43||<0.43||<0.43||<0.43||<0.43||<0.43||<0.43||<0.43||<0.43|
|Matte side, Rz||μm||1.5...2.5||3...5||3...5.5||4...7.5||5...8||6...11||8...13||12...18||<15||<20||<20||<20||<20|
JTC foil is routinely available in continuous rolls and sheeted formats. Roll products can be supplied in a variety of widths and thicknesses from 5 μm to 400 μm (11.5 oz/ft2). Other thicknesses on request. JTCAC is available in 35 and 70 μm (2oz/ft2) in roll or sheet form. Roll products are supplied on cardboard cores with an ID of ~ 79 mm (3 1/8”) or 152 (6”).