Aircraft
JPLHTE (JPLS)- Plainfoil with our HTE-Foil as basis
- Electrodeposited copper foils meet the requirements of E-Cu 58 in accordance with DIN 40 500.
JPLHTE (JPLS)
Plain copper foils get different surfaces, shiny and matte. For better storage and handling the surfaces are protected by a very thin anti-corrosion layer of < 0.005μm of Zinc-Chromate. Foil thickness are close to standard products for printed circuit boards, others on request.
ED copper with high purity
High purity of electro-deposited copper foil due to production process and climate resp. particle controlled conditions.
Wide spectrum of available widths
Individual widths from 120 mm (5") to 2718 mm (107“) are available.
Properties meet and exceed the requirements of IPC 4562, Grade 3
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Shiny side
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Matte side - HTE 35 µm
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JTC-35 μm, cross-section
JPLHTE foil is routinely available in continuous rolls and sheeted formats. Roll products can be supplied in a variety of widths and thicknesses (see above). Other thicknesses on request. Products are supplied on cardboard cores with an ID of ~ 79 mm (3 1/8”) or 152 mm (6”).