combines the advantage of the acclaimed HTE-grade 3 copper foil with a zinc-free treatment to prevent any acid undercut in NiAu plating processes. High bond to most of resin systems is maintained by GOULD's zinc-free treatment technology. JD1HTE is recommended for application on high frequency prepregs like PTFE, epoxy-aramide or multifunctional epoxies. Available also as JD1HTEVLP.
is Nickel Gold compatible. Acidic chemistry in electroless NiAu processes can undercut the zinc layer underneath fine lines, hence reduce contact area (acid undercut) and peel strength.
The fine nodulized D1 treatment (more metallic than oxidic copper) guarantees optimal mechanical and chemical bond.
High layer count PCBs in mobile phones or applications in smart cards/labels require thin foils with low treatment roughness.
Properties are in accordance with IPC-4562 and other international standards.
JD1HTE and JD1 foils are routinely available in continuous rolls and sheeted formats. Roll products can be supplied in a variety of widths and thicknesses from 12 μm (0.375 oz/ft2) to 70 μm (2 oz/ft2). Other thicknesses on request. Products are supplied on cardboard cores with an ID of ~ 79 mm (3 1/8”) or 152 mm (6”).