Technical Papers

Adhesion and Etching of Nickel-Chromium Tiecoat on Adhesiveless Flexible Laminate (3.3 MB)
Bergstresser, T.; Hilburn, R. and Wang, J.

Adhesiveless Copper on Polyimide Substrate with Nickel-Chromium Tiecoat (305KB)
Bergstresser, T.; Hilburn, R.; Kaplan, H. and Le, R.

Embedded Capacitance Materials and Their Application in High Speed Designs (279KB)
Bergstresser, T. and Hilburn, R. (Gould Electronics); Obrzut, J. (NIST) and Phillips, K.

Power Dissipation of Embedded Resistors (297KB)
Wang, J.; Davis, M.; Hilburn, R. and Clouser, S.

Stress Effects on Thin Film Nichrome Embedded Resistor Tolerance (203KB)
Wang, J.; Hilburn, R. and Clouser, S.

Manufacturing Embedded Resistors (469KB)
Wang, J.; Hilburn, R.; Clouser, S. and Greenlee, B.

Copper Foil Treatment for CO2 Laser Direct Drilling (1.1 MB)
Clouser, S.J. and Sakamoto, M.

CTE of Thin Copper Foils for Electronic Laminate Structures (560KB)
Zimprich, P.; Wottle, I.; Merchant, H.D.; Wiechmann, R.; Zagar, B. and Weiss, B

Strain Controlled Mechanical Fatigue of Thin Copper Foil and Flexible Circuit (167KB)
Merchant, H.D. and Mahnke, D.B.

Thermo-mechanical Response of Cu Foils for Microsystems (295KB)
Khatibi, G.; Groger, V.; Merchant, H.D.; Weiss, B. and Wiechmann, R.

Thermoelastic Performance of Copper Foil and Cu/FR-4 and Cu/PI Laminates (308KB)
Khatibi, G.; Klein, M.; El-Magd, E.; Merchant, H.D.; Weiss B.; Wiechmann, R. and Zimprich, P.

Thin Film Embedded Resistors (208KB)
Wang, J.T. and Clouser, S.J

Copper on Polyimide Flexible Substrate For Ultra-Thin, High Performance Applications (101KB)
Bergstresser, T.R. and Sallo, J.S.

Metallurgy and Performance of Electrodeposited Copper for Flexible Circuits (587KB)
Merchant, H.D.; Wang, J.T.; Giannuzzi, L.A. and Liu, Y.L.

Adhesiveless Copper on Polyimide for Flexible Circuit, HDI and Microvia Applications (374KB)
Bergstresser, T.R. and Sallo, J.S.

Adhesiveless Polyimide Laminate Substrates for Flexible Circuit Applications (1.9 MB)
Bergstresser, T.R. and Sallo, J.S.

Hydraulic Bulge Test of Electrodeposited Copper Foil (920KB)
Merchant, H.D. and Rozboril, M.G.

Mechanical Fatigue of Thin Copper Foil (959KB)
Merchant, H.D.; Minor, M.G. and Liu, Y.L.

Thermal Softening of Thin Copper Foil (1.3 MB)
Merchant, H.D. and Minor, M.G.

18 µm Electrodeposited Copper Foil for Flex Fatigue Applications (513KB)
Merchant, H.D.; Minor, M.G.; Clouser, S.J. and Leonard, D.T.

Accelerated Humidity Durability Testing of Adhesiveless Polyimide Laminates (381KB)
Bergstresser, T.R.; Bergkessel, N.E. and Poutasse, C.A.

Bendability of Thin Copper Foil (630KB)
Merchant, H.D.; Minor, M.G. and Rozboril, M.G.

Damage in Copper Foil Based Flexible Circuit During Mechanical Fatigue (1.2 MB)
Merchant, H.D.; Minor, M.G. and Rozboril, M.G.

Effects of Moisture on Peel Strength of Adhesiveless Polyimide Laminates (2.5 MB)
Bergstresser, T.R.; Bergkessel, N.E.; Chiang, S.K. and Poutasse, C.A.

Fatigue Life Statistics for 18 µm Foil Based Flexible Circuits (1.0 MB)
Merchant, H.D.; Mahnke, D.B.; Leonard, D.T. and Clouser, S.J.

Grain Structure of 15 µm Copper Plateup on Polyimide (853KB)
Merchant, H.D.

Adhesion Performance of Polyimide Adhesiveless Flexible Laminates Having Nickel Based Tiecoats (4.7 MB)
Bergkessel, N.E.; Bergstresser, T.R.; Chiang, S.K. and Russell, D.B.

Characterization of Damage During Flex Fatigue of 18 µm Copper Foil (1.0 MB)
Merchant, H.D.; Minor, M.G. and Rozboril, M.G.

Defect Structure and Crystallographic Texture of Polycrystalline Electrodeposits (1.7 MB)
Merchant, H.D. and Girin, O.B.

Peel Strength of Adhesiveless Polyimide Laminates After Thermal and Chemical Exposure (4.6 MB)
Bergstresser, T.R.; Bergkessel, N.E.; Chiang, S.K.; Poutasse, C.A. and Russell, D.B.

Stress Relaxation and Creep of 12 to 35 µm Copper Foil (485KB)
Merchant, H.D.

Effect of Thermal Exposure on Flex and Fold Fatigue Performance of Fine Grained Electrodeposited Copper Foil (1.0 MB)
Merchant, H.D. and Clouser, S.J.

Flex Fatigue of Adhesiveless Copper Plateup on Polyimide (844KB)
Merchant, H.D.; Chiang, S.K. and Minor, M.G.

Fold Fatigue Performance of 18 µm Copper Foil (617KB)
Merchant, H.D.; Clouser, S.J. and Minor, M.G.

Defect Structure of Electrodeposits (1.9 MB)
Merchant, H.D.

Surface Morphology of Electrodeposits (1.7 MB)
Bergstresser, T.R. and Merchant, H.D.

Thermal Response of Electrodeposited Copper (779KB)
Merchant, H.D.

Through-Thickness Characterization of Copper Electrodeposit (664KB)
DeAngelis, R.J.; Knorr, D.B. and Merchant, H.D.

Annealing Kinetics and Embrittlement of Electrodeposited Copper (657KB)
Merchant, H.D.